OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of ...

Ultrawide-bandgap semiconductors—such as diamond—are promising for next-generation electronics due to a larger energy gap between the valence and ...

Physicists from Imperial College London have achieved a groundbreaking milestone in quantum physics by reimagining the classic double-slit experiment—this time in the dimension of time. Led by ...

For thinner films the measurement leads to the formation of a single interference maxima. In this case, it is appropriate to describe the thin-film structure in terms of optical admittances ...

A research team from NIMS and the Japan Fine Ceramics Center (JFCC) has developed a next-generation AI device—a hardware ...

If bird is the word, these last-minute deals are a steal. If saving hundreds is one of your chief concerns, these discounts ...

Absorbing layers have been fundamental to advancements in technologies like energy harvesting, stealth systems, and ...

New design concept enables ultra-thin absorbers with unprecedented bandwidth-to-thickness ratios, verified experimentally to ...

Electromagnetic absorbers are essential in energy, stealth, and communication technologies, yet current designs underperform.