The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with ...

A new technical paper titled “SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology” was published by ...

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

A new technical paper titled “Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals ...

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

Successfully integrate components like MEMS and sensors by considering every aspect of the device from the outset.

The path to fully autonomous vehicles may be clear in concept, but fully realizing that development environment is another ...

A new technical paper titled “Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures” was published by ...

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.