OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of ...

Ultrawide-bandgap semiconductors—such as diamond—are promising for next-generation electronics due to a larger energy gap between the valence and ...

Physicists from Imperial College London have achieved a groundbreaking milestone in quantum physics by reimagining the classic double-slit experiment—this time in the dimension of time. Led by ...

For thinner films the measurement leads to the formation of a single interference maxima. In this case, it is appropriate to describe the thin-film structure in terms of optical admittances ...

A research team from NIMS and the Japan Fine Ceramics Center (JFCC) has developed a next-generation AI device—a hardware ...

Absorbing layers have been fundamental to advancements in technologies like energy harvesting, stealth systems, and ...

If bird is the word, these last-minute deals are a steal. If saving hundreds is one of your chief concerns, these discounts ...

New design concept enables ultra-thin absorbers with unprecedented bandwidth-to-thickness ratios, verified experimentally to ...

Electromagnetic absorbers are essential in energy, stealth, and communication technologies, yet current designs underperform.