S&P 500 gainers on the year. And there could be much more upside in store, according to New Street Research analysts led by ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

Since AI emerged as the world's next megatrend about two years ago, one product in particular has become the technology ...

Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Highlights,Micron Technology begins construction on a new High-Bandwidth Memory (HBM) advanced packaging facility in ...